ABOUT SOME RESULTS OF PROCESSING SiC-MICROARRAYS BY HYDROABRASIVE PRECISION JET
DOI:
https://doi.org/10.20535/2305-9001.2013.67.37833Keywords:
SiC-microarrays, hydro abrasive jetting, cutting qualityAbstract
Purpose. Performing cutting of the microarrays to the individual elements using ultrahigh pressure jet with a finely dispersed abrasive.
Design/methodology/approach. The theory of the hydro abrasive jetting difficult to machine materials. A functional approach to ensure the quality and accuracy of processing.
Findings. In a paper was proved the possibility of using small diameter jet stream to perform precise cuts of microchips with hard and brittle materials, such as SiO-chips with double-sided metalized. Using a functional approach allowed to reduce width of the damage of metallization
Originality/value. The original way of SiO-microarrays cutting using the slotted masks is purposed. The use of such masks significantly increases quality and accuracy of the edges of dissected chipReferences
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